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Solder Joint Reliability of BGA, CSP. Flip Chip, and Fine Pitch SMT - e848
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United States
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OBO - El vendedor acepta ofertas en este artículo.
Detalles
La política de devoluciones
Protección de compra
Opciones de pago
PayPal accepted
PayPal Credit accepted
Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted
Las opciones de envío
No hay precio de envío se especifica en MX
Los buques de
United States
Política de oferta
OBO - El vendedor acepta ofertas en este artículo.
Detalles
La política de devoluciones
Protección de compra
Opciones de pago
PayPal accepted
PayPal Credit accepted
Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted
Rasgos del artículo
| Categoría: | |
|---|---|
| cantidad disponible: |
Sólo uno en stock, para muy pronto |
| Condition: |
Like New |
| ISBN: |
9780070366480 |
| Format: |
Hardcover |
| Type: |
Textbook |
| Language: |
English |
| Publication Year: |
1996 |
| Subject Area: |
Technology & Engineering |
| Publication Name: | |
| Publisher: |
McGraw-Hill Professional Publishing |
| Item Length: |
9.1 in |
| Subject: | |
| Series: |
Electronic Packaging and Interconnection Ser. |
| Item Height: |
1.1 in |
| Author: |
John H. Lau, Yi-Hsin Pao |
| Item Weight: |
24.8 Oz |
| Item Width: |
6.1 in |
| Number of Pages: |
408 Pages |
Detalles del anuncio
| Envío de descuento: |
Pesos de envío de todos los elementos se suman para el ahorro. |
|---|---|
| Publicado en venta: |
September 20 |
| Artículo número: |
1770262393 |
Descripción del Artículo
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- Solder Joint Reliability of BGA, CSP. Flip Chip, and Fine Pitch SMT - e848
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