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Principles of Electronic Packaging Hardcover FREE SHIPPING

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Las opciones de envío

Los buques de 3 business days Detalles
No hay precio de envío se especifica en MX
Los buques de United States Us

Política de oferta

OBO - El vendedor acepta ofertas en este artículo. Detalles

La política de devoluciones

Protección de compra

Opciones de pago

PayPal accepted
PayPal Credit accepted
Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted

Rasgos del artículo

Categoría:

Adult Learning & University

cantidad disponible:

Sólo uno en stock, para muy pronto

Condition:

Very Good

ISBN:

9780070563063

Format:

Hardcover

Type:

Textbook

Language:

English

Publication Year:

1989

Seller Notes:

“VERY GOOD CONDITION.”

Book Title:

Principles of Electronic Packaging Hardcover

Features:

EX-LIBRARY

Series:

Mcgraw-Hill Series in Materials Science and Engineering

Subject Area:

Technology & Engineering

Publication Name:

Principles of Electronic Packaging

Author:

Ronald C. Lasky, Donald P. Seraphim, Che-Yu Li

Publisher:

McGraw-Hill Higher Education

Subject:

Industrial Design / Packaging

Number of Pages:

962 Pages

Detalles del anuncio

Envío de descuento:

Vendedor paga el envío para este artículo.

Publicado en venta:

Más de una semana

Artículo número:

1720116916

Descripción del Artículo

This hardcover textbook titled "Principles of Electronic Packaging" is a valuable resource for anyone interested in the subject area of Technology Engineering. Published by McGraw-Hill Higher Education in 1989, this book provides comprehensive information on the industrial design and packaging of electronic devices. It has a total of 962 pages and is part of the Mcgraw-Hill Series in Materials Science and Engineering. The book was written by Ronald C. Lasky, Donald P. Seraphim, and Che-Yu Li, and features an ex-library status. The format of the book is hardcover and it is published in English. This textbook is a must-have for anyone seeking to deepen their knowledge of electronic packaging and industrial design.