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Principles of Electronic Packaging Hardcover FREE SHIPPING
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Las opciones de envío
Los buques de 3 business days Detalles
No hay precio de envío se especifica en MX
Los buques de
United States

Política de oferta
OBO - El vendedor acepta ofertas en este artículo.
Detalles
La política de devoluciones
Protección de compra
Opciones de pago
PayPal accepted
PayPal Credit accepted
Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted
Rasgos del artículo
Categoría: | |
---|---|
cantidad disponible: |
Sólo uno en stock, para muy pronto |
Condition: |
Very Good |
ISBN: |
9780070563063 |
Format: |
Hardcover |
Type: |
Textbook |
Language: |
English |
Publication Year: |
1989 |
Seller Notes: |
“VERY GOOD CONDITION.” |
Book Title: |
Principles of Electronic Packaging Hardcover |
Features: |
EX-LIBRARY |
Series: |
Mcgraw-Hill Series in Materials Science and Engineering |
Subject Area: |
Technology & Engineering |
Publication Name: |
Principles of Electronic Packaging |
Author: |
Ronald C. Lasky, Donald P. Seraphim, Che-Yu Li |
Publisher: |
McGraw-Hill Higher Education |
Subject: |
Industrial Design / Packaging |
Number of Pages: |
962 Pages |
Detalles del anuncio
Envío de descuento: |
Vendedor paga el envío para este artículo. |
---|---|
Publicado en venta: |
Más de una semana |
Artículo número: |
1720116916 |
Descripción del Artículo
This hardcover textbook titled "Principles of Electronic Packaging" is a valuable resource for anyone interested in the subject area of Technology Engineering. Published by McGraw-Hill Higher Education in 1989, this book provides comprehensive information on the industrial design and packaging of electronic devices. It has a total of 962 pages and is part of the Mcgraw-Hill Series in Materials Science and Engineering.
The book was written by Ronald C. Lasky, Donald P. Seraphim, and Che-Yu Li, and features an ex-library status. The format of the book is hardcover and it is published in English. This textbook is a must-have for anyone seeking to deepen their knowledge of electronic packaging and industrial design.
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