Rendered at 09:06:20 05/22/25
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Thermaltake - TG-30 - Premium CPU/GPU Heatsink Thermal Compound - 4g
$481.74 MXN
Los buques de
United States

Las opciones de envío
Estimado para llegar por Thu, May 29th.
Detalles
Calculado por USPS en MX.
Los buques de
United States

Política de oferta
OBO - El vendedor acepta ofertas en este artículo.
Detalles
La política de devoluciones
Replacement product available within 30 days
Protección de compra
Información del catálogo
Opciones de pago
PayPal accepted
PayPal Credit accepted
Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted
Las opciones de envío
Estimado para llegar por Thu, May 29th.
Detalles
Calculado por USPS en MX.
Los buques de
United States

Política de oferta
OBO - El vendedor acepta ofertas en este artículo.
Detalles
La política de devoluciones
Replacement product available within 30 days
Protección de compra
Información del catálogo
Opciones de pago
PayPal accepted
PayPal Credit accepted
Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted
Rasgos del artículo
Categoría: | |
---|---|
cantidad disponible: |
10 En stock |
Condition: |
New |
UPC: |
841163075845 |
Model: |
CL-O023-GROSGM-A |
MPN: |
CL-O023-GROSGM-A |
Type: |
Thermal Compound |
Packaging: |
Syringe |
Brand: |
Thermaltake |
Material: |
Aluminum Oxide |
Fan Light Color: |
Beige |
Color: |
Gray |
Compatible Brand: |
Universal |
Fan Diameter: |
None |
Maximum Fan Speed: |
None |
Maximum Airflow Volume: |
None |
Volume / Net Weight: |
4.0g |
Thermal Conductivity: |
4.5 W/mK |
Long Term Operating Temperature: |
-50 to 200 C |
Series: |
TG-30 |
Power Connection: |
None |
To Fit: |
Chipset - Northbridge, Chipset - Southbridge |
Detalles del anuncio
Envío de descuento: |
Vendedor paga el envío para este artículo. |
---|---|
Publicado en venta: |
Más de una semana |
Artículo número: |
1134045378 |
Descripción del Artículo
Brand NEW!
Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs
- All international buyers are responsible for all tax, duties and/or customs fees.
Added to your wish list!

- Thermaltake - TG-30 - Premium CPU/GPU Heatsink Thermal Compound - 4g
- 10 in stock
- Price negotiable
- Handling time 2 day. Estimated delivery: Thu, May 29th
- Returns/refunds accepted
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